JPS635476B2 - - Google Patents

Info

Publication number
JPS635476B2
JPS635476B2 JP54146182A JP14618279A JPS635476B2 JP S635476 B2 JPS635476 B2 JP S635476B2 JP 54146182 A JP54146182 A JP 54146182A JP 14618279 A JP14618279 A JP 14618279A JP S635476 B2 JPS635476 B2 JP S635476B2
Authority
JP
Japan
Prior art keywords
conductive member
conductive
members
positioning
rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54146182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5669397A (en
Inventor
Akitoshi Inoe
Seiichi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anritsu Corp
Original Assignee
Anritsu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anritsu Corp filed Critical Anritsu Corp
Priority to JP14618279A priority Critical patent/JPS5669397A/ja
Publication of JPS5669397A publication Critical patent/JPS5669397A/ja
Publication of JPS635476B2 publication Critical patent/JPS635476B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
JP14618279A 1979-11-12 1979-11-12 Holding apparatus for electroplating Granted JPS5669397A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14618279A JPS5669397A (en) 1979-11-12 1979-11-12 Holding apparatus for electroplating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14618279A JPS5669397A (en) 1979-11-12 1979-11-12 Holding apparatus for electroplating

Publications (2)

Publication Number Publication Date
JPS5669397A JPS5669397A (en) 1981-06-10
JPS635476B2 true JPS635476B2 (en]) 1988-02-03

Family

ID=15401983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14618279A Granted JPS5669397A (en) 1979-11-12 1979-11-12 Holding apparatus for electroplating

Country Status (1)

Country Link
JP (1) JPS5669397A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101423416B1 (ko) * 2013-01-25 2014-07-24 케이씨케미칼 주식회사 공작물 표면처리용 지그
CN103510144A (zh) * 2013-09-17 2014-01-15 兰继红 一种金属件电镀悬挂架

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4214766Y1 (en]) * 1964-07-11 1967-08-23
JPS5535340Y2 (en]) * 1974-05-27 1980-08-20
JPS52441U (en]) * 1975-06-23 1977-01-05
JPS5731153Y2 (en]) * 1979-06-13 1982-07-08

Also Published As

Publication number Publication date
JPS5669397A (en) 1981-06-10

Similar Documents

Publication Publication Date Title
US4752371A (en) Elongated frame for releasably-holding printed circuit boards
US6887113B1 (en) Contact element for use in electroplating
JP2006117979A (ja) 電気メッキ装置におけるワークハンガー
US3429786A (en) Controlled electroplating process
JPH0773120B2 (ja) 電気めつき装置
JPS635476B2 (en])
US3970540A (en) Clamping device for use in electroplating
JPS6349759B2 (en])
US2911347A (en) Plating rack
CA2341218A1 (en) Contact element
JPS6254880B2 (en])
JP3062911B2 (ja) メッキ装置
US3701726A (en) Support assembly for electrolytic deposition on contact element
JP4216734B2 (ja) 電気分解用移動・絶縁装置および電解設備
US2523973A (en) Plating rack
KR102310344B1 (ko) 반도체칩 범용홀더
TWM574156U (zh) 用於電鍍機的框形托架
JP3239534B2 (ja) メッキ用ラック
US7070688B2 (en) Electroplating tool and method for selective plating
KR200425044Y1 (ko) 연속 도금장치의 인쇄회로기판용 통전지그
US6051119A (en) Plating structure for a pin grid array package
US4308009A (en) Furnace frame attachment boat and method
JPH0280599A (ja) Icリードフレームのメッキ用引っ掛け治具
US3056739A (en) Electroplating rack
JP2021031687A (ja) 搬送トレー、および、セラミック配線基板の製造方法